Multiphysics Analysis Solutions for Chips and 3D IC Systems.

Create Reliable and Efficient Designs With Production-Proven Multiphysics Analysis

Ansys cloud-native solutions provide unparalleled capacity to speed up completion times for even the largest finFET integrated circuits (IC) and 3D/2.5D multi-die systems. These powerful multiphysics analysis and verification tools reduce power consumption, improve performance and reliability, and lower project risk with foundry-certified golden signoff verification.

Semiconductors overview

The semiconductor product line delivers significant advances in performance and capacity for advanced node chips, introducing new features for multi-die design’s thermal and Multiphysics analysis.

Enhanced thermal integrity flow for sub-5nm and 3D IC designs, including new hierarchical Chip Thermal Models (CTM)
SigmaDVD technology delivers new power integrity capabilities in RedHawk-SC, accurately analyzing dynamic voltage drop (DVD) effects in leading-edge designs
Reduced Order Models (ROM) enable a high-capacity analysis of chip and package systems while maintaining result accuracy
Incremental fixing of IR-drop with the new IR-ECO flow that integrates RedHawk-SC signoff analysis with popular implementation tools for physical ECOs
Introducing PathFinder-SC, built on the cloud-optimized SeaScape platform, delivers 4x speed and 3x memory reduction essential for electrostatic discharge (ESD) analysis
Achieve up to 2x speed with RaptorX distributed processing, essential for on-die electromagnetic analyses of high-speed signals

ANSYS Safety Products

Ansys RedHawk-SC

Golden IR-drop signoff verification for digita designs Electro migration reliability signoff

Ansys Clock FX

Ansys Clock FX software for IC design performs fast, SPICE-accurate transistor level timing analysis.

Ansys RaptorQu

Ansys RaptorQu is a unique electromagnetic solver for superconductive silicon designs that enables.

Resources & Events

Calculation of heating due to losses in HF fields

Calculation of heat generation and heating of a terminating resistor for rectangular waveguides

Transient temperature distribution and thermal stress

How to calculate a transient temperature distribution and the resultant thermal stress.

Sound radiation

Sound radiation of a railway wheel with Ansys Workbench


Ansys Redhawk SC (digital) and Ansys Totem (analog) are the world’s leading solutions for SoC power integrity
analysis. You can model supply voltage variations with foundry-verified signoff accuracy and reduce the overall
power noise impact through the package and board. Current density and electromigration analysis are thermal-
aware for both power supply metal and signal interconnect on chip or package layers.

Ansys RedHawk-SC’s diagnostics capabilities identify the sources of dynamic power supply noise through vectored
and vectorless activity that give comprehensive coverage and eliminate voltage escapes and potential frequency
loss. Ansys Path FX provides a variation-aware static timing analysis of critical paths to SPICE accuracy across all
voltages with just a single timing library file.

Ansys RedHawk-SC Electrothermal provides multiphysics analysis for stacked multi-die packages for power integrity,
thermal analysis, and mechanical stress/warpage – all the way from early prototyping to final signoff This high-
capacity multiphysics analysis is in full context of the entire 2.5D/3D system for maximum accu racy and to ensure
system reliability. The co-simulation analysis integrates to system-level tools including Ansys Icepak and Ansys

Ansys_RaptorH has the capacity capacity to model power grids, full custom blocks, spiral inductors, and clock trees.
Its high-speed distributed processing delivers accurate, silicon-proven S-parameter and RLCk models. RaptorH
makes it easy to use either the general purpose H FSS engine or the silicon-optimized RaptorX engine.

simulates human body model (HBM) and charge device model (CDM) events for static and transient
silicon-correlated accuracy. It ensures ESD integrity and reduces debugging turnaround time.
Ansys_IQtem is a comprehensive co-simulation framework for analog, mixed-signal and custom circuit designs and
provides a comprehensive fullÆhip solution for modeling and simulating noise injection, propagation and coupling
through the on-die power grid RLC, substrate RC, and package RLC networks.

Ansys SeaScape infrastructure provides per-core scalability, flexible design data access, instantaneous design bring-
up, MapReduce-enabled analytics, and many other revolutionary capabilities. With unparalleled scalability across
thousands of cores using big data techniques, Ansys RedHawk•SC helps you sign off billion+ instance designs within
a few hours on commodity hardware. No dedicated machines are needed.